Capa Electronic
Automated Optical Inspection,
U.V. or X-Ray
Capa Electronic
Automated Optical Inspection,
U.V. or X-Ray
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YTX-3000 X-Ray Not In-Line
High resolution X-ray system
X-Ray inspection for :
- BGA / Flip chip
- Solder joint quality
- Voids
- Bond wires
- Electronic and sealed assemblies
X-Series In-Line
Automated In-Line X-ray inspection system
Automated inspection for :
- Opens & shorts
- Insufficient / excess solder
- Lifted leads
- BGA
- Voids
- Component presence and position